About DL
company profile
vision & Mission
milestones
location
News
Latest News
news Archieve
Products
Memory Card
COB type USB Flash Device
eMMC 、eMCP and MCP
BGA and LGA
TSOP I/II
QFN
Technology
Thin wafer technology
Die stacking and wire bonding
Chip stacking and wire bonding
SiP technology
Ultra thin LGA technology
Substrate design and simulation
MEMS package
Wafer level technology
Quality Management
Quality Policy
Quality Policy
Certification
Certification
Reliability / Failure Analysis
Reliability
Failure Analysis
GP/HSM
Green Policy
Green Products
Green Quarterly
FAQ
Career
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Cultivating talents
Contact
CSR
CSR
Caring System
Sourcing Policy for Conflict Mineral
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Us
次選單
Location
Tel:+886-37-595888 FAX:+886-37-599955
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