Products

TSOP I/II

 
● TSOP I
 
Thin Small Outline Package (TSOP) I & II are very low-profile and have tight lead spacing. Due to its thin profile, TSOP is well suited for memory products, including SDRAM and NAND Flash. A green BOM is standard with DL-tek, allowing devices to meet applicable Pb-free and RoHS standards. DL-tek offers TSOP (I) 48, TSOP (II) 50 and 54 pins packaging, the product includes ROM, NOR, NAND Flash. In particular, we offer NAND Flash TSOP48 packaging stacked die up to 4X .

                                                         

 

● TSOP II

 

 

 

RELIABILITY

• Lead free 
 Convention 260℃
• Pre-conditioning 
 Level 3 : 30℃、60%RH、192 hours
• Temperature cycling
 -65~150℃、1000 cycles
• Temperature and humidity
 85℃、85%RH、1000 hours
• High temperature storage test
 150℃、1000 hours
• Highly-accelerated stress test
 130℃、85%RH 168 hours

 

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