Products

eMMC 、eMCP and MCP

Multi-Chip Packaging (MCP) combines LPDDR die-stacking and NAND flash memory a single package. DL-tek provides a broad ion of embedded memory packaging and testing technologies on a single printed circuit board. These technologies include eMMC packaging ( controller device + NAND flash) and eMCP packaging ( controller device + NAND flash + LPDDR memory). DL-tek offers a wide range of memory configurations, the majority of which involve multiple dies. MCP memory modules in the system streamlines the development process and allows products to be shipped much faster.

 

 

 

RELIABILITY

• Lead free 
 Convention 260℃
• Pre-conditioning 
 Level 3 : 30℃、60%RH、192 hours
• Temperature cycling
 -65~150℃、1000 cycles
• Temperature and humidity
 85℃、85%RH、1000 hours
• High temperature storage test
 150℃、1000 hours
• Highly-accelerated stress test
 130℃、85%RH 168 hours

 

Previous