Products

QFN

The Quad Flat No-leads (QFN) package offers a variety of benefits including: reduced lead inductance, smaller footprint, thin profile, and low weight comparable to the Chip Scale Package (CSP). This package is designed to provide both thermal and electrical enhancement and often used in power management and controller ICs, ESD, and RF communications chips.

 

 

 

RELIABILITY

• Lead free 
 Convention 260℃
• Pre-conditioning 
 Level 3 : 30℃、60%RH、192 hours
• Temperature cycling
 -65~150℃、1000 cycles
• Temperature and humidity
 85℃、85%RH、1000 hours
• High temperature storage test
 150℃、1000 hours
• Highly-accelerated stress test
 130℃、85%RH 168 hours

 

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