Ultra thin LGA technology

Land Grid Array (LGA) is a surface mount integrated device and passive circuit package comparable to the BGA, only without the characteristic solder balls. LGA packages are small and light, featuring excellent electrical performance and low production cost. LGAs are manufactured with laminate substrates. LGA’s also feature slimmer profiles than BGA’s due to the exclusion of solder balls. LGA’s are primarily found in mobile communication and computing devices such as processors, memory devices, and RF chipsets.