Wafer level technology

Wafer level packaging is an innovative process that comprises of fabrication, packaging, testing, and burn-in all performed at wafer level in order to streamline the manufacturing process. WLCSP includes wafer bumping (with or w/o layer, redistribution layer, or RDL), wafer level final testing, device singulation, and packing with tape & reel support. DL-tek will begin offering wafer level processing technologies, including redistribution and wafer bumping services, in 2014.