Thin wafer technology

The thin wafer process employs DL-tek’s state of the art facilities and methods to create ultra-thin die. Wafer grinding, die sawing, and die bonding techniques allow DL-tek to minimize die profile. This in turn allows us to maximize the number of chips stacked in a single package. In 2013, DL-tek began mass production of 30μm chips and fielded a limited amount of 25μm chips. DL-tek will begin production of 20μm chips in 2014.